Both the SICK CLV61X and the RFU61X are already well known for their compact dimensions and wide-ranging connectivity with standard communications interfaces. The addition of IO-Link opens up opportunities to configure edge integrations with other IO-Link sensors and IO-Link Masters. It promises to improve data transparency from the lowest field level right up to the Cloud.
With IO-Link, using either device for identification also presents an opportunity to reduce cabling significantly, lowering costs and enabling more efficient installation.
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